t-Global Technology product range

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Thermal Interface Materials
Thermal interface materials are highly conductive, conformable materials which are used to provide a heat path between heat sinks and electronic devices where uneven surface topography, air gaps and texture preclude good thermal transfer. Typically thermal interface materials range in thickness from 0.25 – 5mm.

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Die-Cut Insulator Parts
At t-Global Technology we have impressive die-cutting capabilities using a wide range of insulator materials and processes.
Download the t-Global Die-Cut Insulators part number guide.

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Thermally Conductive Insulator Materials
Thermally conductive insulator materials are used when a key requirement is a low thermal resistance combined with a high dielectric breakdown strength. Typically thermally conductive insulator materials range from 0.1 – 0.2mm thick.

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Thermal Heat Spreaders
Thermal heat spreaders are used to provide low-cost, effective means of cooling critical components where space is restricted and conventional heat sinks are not appropriate.

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Thermal Greases
Thermal greases offer a convenient and economic heat transfer path for applications requiring thin bond lines and high performance. T-Global’s greases are designed to be exceptionally stable under environmental conditions and will not dry or pump-out during use. Greases can be dispensed, screen printed or stencilled onto a substrate to give superior thermal performance.

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Thermally Conductive Gels
Thermally conductive gels are two-part systems that provide highly stable, high thermal conductivity encapsulation for electronic components. These products offer the ultimate combination of thermal conductivity, electrical isolation and stability.

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Flexible Absorbent Materials
These products offer EMI suppression combined with high thermal conductivity making them suitable for RFID devices, communication devices, set-top boxes and wireless equipment.

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High Performance Circuit Boards
These products have specifically been developed with reference to the LED industry and provide a through-plane thermal conductivity of up to 15 W/mk. This will allow designers to manage heat dissipation, optimise surface circuit real estate and add design flexability.