H48-2K Thermal Conductive Pad

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Description

H48-2K is an ultra thin, silicon based gap filler which is designed for applications which require a high dielectric breakdown voltage combined with ultra low silicone outgassing. H48-2K is available in various formats such as standard sheets or custom die cuts to support both prototyping and high volume manufacturing.

H48-2K-150-150-0.2-0
H48-2K-320-320-0.2-0
H48-2K-640-320-0.2-0
Property
Value
Unit
Type of Product
Thermal Interface Material
-
Thermal Conductivity
2.2
W/mK
Hardness
85
Shore A
Dielectric Breakdown Voltage
1.2-3.5
kV/mm
Colour
Dark Red
-
Thickness
0.1-0.3
mm
Format
Die-cut Pad, Pad, Sheet
-