TG-S606C Thermal Compound

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Description

TG-S606C is a silicone based thermal grease that has been designed for high performance CPUs and similar applications. It has a thermal conductivity of 5 W/mK, superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability.

Features
Good thermal conductivity
Easy to assemble
High stability
Does not harden with time

Applications
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.

Property
Value
Unit
Type of Product
Grease
-
Thermal Conductivity
5
W/mK
Colour
Dark Grey
-
Format
Syringe, Pot, Pail
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