TG-S808 Thermal Compound is a high-performance silicone based thermal grease that has been designed for high performance CPUs and similar applications. It has a thermal conductivity of 8 W/mK. TG-S808 Thermal Compound provides superior wetting characteristics, resulting in a very low thermal resistance and excellent long-term reliability.
High thermal conductivity
Good levelling agent
Low thermal impedence/thermal resistance
Electronic components: IC, CPU, MOS, LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
TG PP 10