TG-S808 Thermal Compound

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Description

Description

TG-S808 is a high-performance silicone based thermal grease that has been designed for high performance CPUs and similar applications. It has a thermal conductivity of 8 W/mK, superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability.

Features

High thermal conductivity
Good levelling agent
Low pump-out
Low thermal impedence/thermal resistance
High stability
 

Applications

Electronic components: IC, CPU, MOS, LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
 

S606P
S606
PP10
606
TGS606
TG-S606P
Property
Value
Unit
Type of Product
Grease
-
Thermal Conductivity
8.0
W/mK
Colour
Grey
-
Format
Pot
-