TGNSP36K Non-Silicone Putty

Request Sample Datasheet (PDF) Compare
The 'Buy Now' button leads to our distributor Digi-Key Electronics' website.

Description

TG-NSP36K is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic devices. This material is designed to optimize flow from a dispensing system and also provides a low thermal impedance for enhanced cooling.

Property
Value
Unit
Type of Product
Putty
-
Thermal Conductivity
4.5
W/mK
Colour
Light Grey
-
Format
Syringe, Pot, Pail
-