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Datasheet (PDF)
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Description
TG-NSP36K is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic devices. This material is designed to optimize flow from a dispensing system and also provides a low thermal impedance for enhanced cooling.
Property
Value
Unit
Type of Product
Putty
-
Thermal Conductivity
4.5
W/mK
Colour
Light Grey
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Format
Syringe, Pot, Pail
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