Available to apply adhesive,pre-cut for different shapes.

Available to apply adhesive,
pre-cut for different shapes.

L37-3F Thermal Conductive Pad

Features

  • Good thermal conductivity
  • Easy to assemble
  • Good insulator
  • Carrier: Fiberglass

Application

  • Electronic components: IC / CPU / MOS
  • LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub……etc.
  • DDR II Module / DVD Applications / Hand-set applications…etc.

Thermal Impedance V.S Pressure

L37-3F, 1.40 W/mK

Click image above to see an enlarged version

Property

L37-3F Unit Tolerance Test Method
Colour Yellow - - Visual
Thickness 0.25 / 0.3 / 0.45 mm - ASTM D374
0.0098 / 0.0118 / 0.0177 inch - ASTM D374
Thermal Conductivity 1.4 W/mK - ASTM D5470
Flammability Rating V-0 - - UL94
Dielectric Breakdown Voltage 3 / 4 / 5 kV - ASTM D149
Weight Loss <1 % - ASTM E595
Specific Gravity 2.0 g/cm³ ±0.2 ASTM D792
Working Temperature -40 to 200 - -
Volume Resistance >1013 Ohm-cm - ASTM D257
Elongation 5 % ±0.2 ASTM D412
Tensile Strength 150 Kgf/cm² ±5 ASTM D412
Standard Shape - Sheets
320-320mm
- -
Hardness 80 Shore A ±3 ASTM D2240
REACH Compliant RoHS Compliant