The continued advancement of the technology industry has seen a sharp rise in market demands for improved thermal management solutions which means current thermal interface materials are often subject to be scheduled for End of Life (EoL) as new products are brought to market.
T-Global Technology is committed to continually improving and developing its range of thermal interface materials to ensure our customers benefit from market leading solutions for their heat dissipation challenges.
Heat dissipation is a key area for many industries, manufacturers from a range of disciplines require higher performance products with increased conductivity, often coupled with the need for smaller components or surface areas to offer improved functionality, faster processing and extended life cycles.
Several new products are now available for samples or quotes via our product page and are listed in reverse chronological order with the newest items at the top of the page.
These include thermal pads, putties and compounds which will be succeeding historic products that are now nearing End of Life (EoL) and are not recommended for new design (NRND).
Below is a table outlining the materials planned for EoL with links to our recommended alternatives.
| Product NRND (EoL) | Alternative |
| H48-6S Thermal Conductive Pad | TG-ALC / GT10D |
| Li98 Thermal Tape | TG-T1000 |
| TG-AH482 Thermal Conductive Pad | TG-A20KX / TG-A3500 |
| H48-2K Thermal Conductive Pad | TG-ALC |
| TG-AH486 Thermal Conductive Pad | TG-A38KX / TG-A3500 |
| H48-6A Thermal Conductive Pad | TG-A38KX |
| Li2000 Thermal Tape | Li98C |
| Li2000A Thermal Tape | Li98C |
| Li98P Thermal Tape | Li98C |
| TG-A2030 Ultra Soft Thermal Conductive Pad | TG-A2200/TG-A3500 |
| TG-A4040 Ultra Soft Thermal Conductive Pad | TG-A4500 |
| TG-A404F Ultra Soft Thermal Conductive Pad | TG-A4500F |
| TG4040LC Ultra Soft Thermal Conductive Pad | TG-A4500F |
| TG-A6050 Ultra Soft Thermal Conductive Pad | TG-A6200 |
| TG832 Ultra Soft Thermal Conductive Pad | TG-A6200 |
| TGNSP36K Non-Silicone Putty | TG-NSP35LV |
| TGNSP36K-1 Non-Silicone Putty | TG-NSP35LV |
| TG-A126X Ultra Soft Thermal Conductive Pad | TG-A1250 |
| TG-AL373 Thermal Conductive Pad | TG-A20KF / TG-A3500 |
| TG-NSP35 Non-Silicone Thermal Putty | TG-NSP35LV |
| TG-S606 Thermal Compound | S606C |
| Liv2 Thermal Tape | TG-T1000 |
| TG-A373L Thermal Conductive Pad | TG-A20KX |
| TG-A373S Thermal Conductive Pad | TG-A3500 |
| TG-AL375 Thermal Conductive Pad | TG-A20KX |
| L37-5S Thermal Conductive Pad | TG-A3500 |
| H48-6G Thermal Conductive Pad | TG-A6200/TG-A6200LC |
| TG-A373F Thermal Conductive Pad | GT10D / TG-A20KF / TG-ALC |
| TG-PP-10 Silicone Thermal Putty | TG-A7000 |
| GT Series Thermal Pad (GT15 / GT20 / GT30) | GT10D / TG-ALC / TG-A38KF / TG-A20KF |
| TG994 Thermal Conductive Pad | TG-A1250 |
Customers are advised that if their preferred product is scheduled for EoL and is already being used in existing production lines to contact us for a repeat order and a member of our technical sales team will be more than happy to assist.