T-Global’s Top Ten Products of 2025

10. TG-AD66

Kicking off our countdown and making its chart debut is one of our newly launched product lines, TG-AD66 is the mid-range pad in our innovative hybrid AD Series of pads which bridge the gap between a pad and putty.  TG-AD66 is an ultra-soft thermal pad engineered to perform with the conformability of a putty whilst retaining the cleanliness, stability, and ease-of-use of a pad format and offers 6.5 W/mK thermal conductivity alongside a shore hardness of 25 00.

Find out more about this brand new best seller here: TG-AD66 Thermal Pad

9. TG-AD75

Another new entry in at number 9 is one more from our AD series, proving that these new pads are enabling engineers and manufacturers to simplify assembly processes, reduce rework and QC inspection times, and extend product longevity – without compromising on thermal design margins. The AD-75 offers the same characteristics as its AD-66 counterpart but with even higher conductivity of 7.5 W/mK.

Find out more about this high flying hybrid thermal pad here: TG-AD75 Thermal Pad

8. TG-A3500 

Holding its place at number 8 for the second-year running is our TG-A3500 Ultra Soft Thermal Pad, this economical gap pad remains a firm customer favourite despite its softness (35 Shore 00!) and offers 3.5 W/mK conductivity. Thanks to its tacky surfaces, it conforms well to uneven surfaces, helping maintain low thermal impedance in cost-sensitive designs without compromising on performance.

Find out more about this ever popular pad here: TG-A3500 Ultra Soft Thermal Pad

7. TG-AS606C

Slipping its way into seventh place for its first chart appearance is our TG-AS606C Thermal Paste. This high-stability silicone-based grease has a thermal conductivity of 5.3 W/mK, excellent wetting characteristics, and long-term reliability. It’s ideal for applications where a very thin, uniform TIM layer is needed, for example: in IC-to-heatsink interfaces, CPUs, or tightly packed power modules.

Find out more about this best seller here: TG-AS606C Thermal Paste

6. T68 

In at six and climbing its way up the chart from seventh place last year is T68 Synthetic Graphite which brings its ultra-thin, lightweight, highly oriented graphite polymer film to the spotlight. As per our 2024 review, this material has in-plane conductivity up to 1,500 W/mK, making it significantly better than copper in the XY axis. Its flexibility, low resistance, and great EMI shielding make it a go-to choice for spreading heat in highly compact designs where space and efficiency are at a premium.

Find out more about what makes this TIM shine here: TG-68 Synthetic Graphite

5. Heat Sink

Sinking into fifth place down from third last year are our Aluminium Heat Sinks and despite dropping two places their mid-table position in the chart proves that they continue to be indispensable products for passive thermal management. Their finned profiles maximise surface area for effective heat dissipation, and we offer both standard and custom sizes and finishes. Whether in consumer electronics, power modules, or embedded systems, our heat sinks provide a reliable, maintenance-free solution for managing thermal loads.

Find out more about this product profile here: Aluminium Heat Sinks

4. TG-A6200

For our number four and dropping one place from last year is TG-A6200 Ultra Soft Thermal Pad, a high-performance silicone-based gap filler. It features 6.2 W/mK thermal conductivity, a Shore 00 hardness of 50, and an impressive dielectric breakdown voltage of 6 kV/mm. With its natural tack and availability in standard sheets or die-cut parts, it’s perfect for high-reliability applications where electrical insulation and conformability matter, like in power electronics or compact modules such as our M2.SSD range.

Find out more about this popular pad here: TG-A6200 Ultra Soft Thermal Pad

3. TG-A1780

Climbing three places this year to secure third place is TG-A1780 Ultra Soft Thermal Pad, one of our most thermally advanced pads. It offers our highest thermal conductivity in pad format, an impressive 17.8 W/mK, alongside and a softness of 70 Shore 00 to give an excellent balance of performance and mechanical compliance. Available in a range of sheet or die-cut formats, it’s particularly well-suited for high-power applications in EVs, telecoms, and other high-density, high-heat generating designs.

Find out more about this bronze place best seller here: TG-A1780 Ultra Soft Thermal Pad

2. TG-N909

In second place and our biggest chart climber of the year (up from ninth in 2024) TG-N909 Non-Silicone Thermal Paste represents our powerful silicone free formula thermal grease. With a thermal conductivity of 9 W/mK, this one-part, fully cured compound delivers low impedance and outstanding reliability under extreme conditions such as thermal cycling, vibrations, and shock. Its non-silicone formulation also minimises pump-out and degradation, making it ideal for long-life, mission-critical systems and silicone sensitive applications such as optoelectronics.

Find out more about this silicone-free chart climber here: TG-N909 Non-Silicone Thermal Paste

1. TG-A1250 

Topping our list, again, for 2025 is the TG-A1250 Ultra Soft Thermal Pad, our best-selling thermal pad. It combines 12.5 W/mK conductivity with a low Shore 00 hardness of 55, giving you high thermal performance with excellent compliance and electrical isolation. Its dielectric breakdown voltage of >10 kV/mm and wide operating temperature range of –50 °C to +180 °C make it a reliable choice across a broad spectrum of applications, from aerospace and EVs to AI, VR, and beyond. This best selling silicone based gap pad is also available with our TG-ALC carrier in our TG-A1250LC to offer enhanced strength and a natural tack.

Find out more about our chart topping number one best seller for 2025 here: TG-A1250 Ultra Soft Thermal Pad

Why These Products?

Innovation meets demand: Several entries like the AD-series reflect how we’re pushing into next-gen applications with very soft, high-conductivity interface materials.

Proven core products: Our heat sinks and classic pads (they’re called the A-Series for a reason) show that tried-and-tested solutions remain essential.

Diverse applications: From compact high-speed computing to rugged, high-vibration environments, this list highlights how we cater to a wide spectrum of industry applications.

Looking forward to 2026, will TG-A1250 retain its gold status to make it a gap-pad hat trick or will we see some newly launched products like our thermal modules or gels steal the top hot-spot?  Only TIMe will tell and, in the meantime, why not click the buttons below to browse our full product range, find out more about our thermal simulation service or contact us for more information and to request your free samples…