New thermal interface material TG-AD30D Low Outgassing thermal Pad delivers enhanced outgassing performance for high-reliability electronics and sensitive environments
T-Global Technology is pleased to announce the launch of the new TG-AD30D, an advanced low-outgassing thermal pad designed for applications where thermal performance, reliability, and material stability are critical.
As the latest addition to the innovative TG-AD hybrid thermal pad family, TG-AD30D builds on the success of existing AD-series materials that handle like a pad but perform like a putty whilst introducing significantly improved outgassing performance for sensitive electronic environments.
With a thermal conductivity of 3.0 W/mK, low thermal impedance, and excellent electrical insulation properties, TG-AD30D is optimised for high-power applications requiring efficient heat transfer and dependable mechanical compliance with minimal outgassing.
Engineered to ASTM E595 standards for demanding applications across aerospace, AI infrastructure, datacom, automotive electronics, energy storage, military systems, and advanced industrial equipment, TG-AD30D helps manufacturers address thermal challenges without compromising long-term system reliability.
TG-AD30D extends our hybrid thermal pad portfolio with a material specifically developed for applications where outgassing performance is a major design consideration, this product enables customers to achieve reliable thermal management in increasingly sensitive and high-performance electronic systems.
TG-AD30D Low Outgassing Thermal Pad Overview:
Enhanced low-outgassing formulation
High thermal conductivity with low thermal impedance
Soft, conformable interface material for uneven surfaces
Excellent dielectric performance
UL 94 V-0 flame rating
Wide operating temperature range from -50°C to +150°C
REACH and RoHS compliant
TG-AD30D is available in thicknesses from 0.5 mm to 5.0 mm and can be supplied in custom die-cut formats to support a wide range of manufacturing requirements.
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