CMC AlSiC Heat Spreader

Description

CMC AlSiC Heat Spreader

The CMC AlSiC Heat Spreader is engineered to deliver exceptional thermal performance in demanding environments. This ceramic matrix composite (CMC) combines aluminium and silicon carbide (AlSiC) to offer a superior balance of mechanical strength, thermal conductivity, and dimensional stability.

Key Features:

• Outstanding mechanical stability: Maintains structural integrity under high-temperature processing, including thermal cycling and soldering, without warping.
• Low coefficient of thermal expansion (CTE): With a CTE ranging from 6 to 12×10⁻⁶/K, AlSiC closely matches common ceramic substrates like AlN (4.5×10⁻⁶/K) and Al₂O₃ (6.7×10⁻⁶/K), enhancing thermal stability in IGBT power modules and IC packaging.
• High thermal conductivity: Efficiently dissipates heat, leveraging the thermal properties of aluminium and silicon carbide.
• Lightweight design: At approximately one-third the density of copper, AlSiC enables significant weight reduction, crucial for applications where mass is a critical factor.
• Ultra-thin form factor: Available in thicknesses down to 1 mm, facilitating compact and space-saving designs.
• Enhanced durability: Covalently bonded SiC particles within the matrix provides high bending strength and wear resistance.
• Proven reliability: Demonstrates a longer thermal cycling lifespan compared to copper.
• Vibration resistance: Successfully passes rigorous vibration resistance tests, ensuring reliability in dynamic environments.

Applications:

T-Global’s CMC AlSiC Heat Spreader is ideal for a wide range of industries and applications, including:

• Power Electronics
• Semiconductor Packaging
• Electric Vehicles (EVs)
• Aerospace & Defence
• High-Performance Computing & Data Centres
• Renewable Energy Systems
• Precision Machinery & Instrumentation
• Telecommunications Equipment
• Medical Electronics
• Industrial Automation
• Laser and Optronics
• Test & Measurement Instruments