GT Series Thermal Pad

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Description

By using a special process, the silicone is used as the base material, by adding a thermal conductive powder and flame retardant together to make the formula become this thermal interface material. Our GT Series is effective in lowering the thermal resistance between the
heat source and the heat sink.

Features
Smooth surface & low contact resistance
Usable over a wide temperature range
Electrical insulation; high breakdown voltage

Applications
Electronic components: IC, CPU, MOS, LED, Motherboard, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecoms, Wireless Hub, DDR ll Module, DVD Applications, Hand-set Applications

Properties
REACH Compliant
ROHS Compliant

Property
Value
Unit
Type of Product
Thermal Interface Material
-
Thermal Conductivity
1.6, 2.1, 3.2
Wm/K
Dielectric Breakdown Voltage
(AC) 4.1-3.1 (DC) 6.1-5.1
kW/mm
Colour
Yellow, Green, Pink
-
Thickness
0.23, 0.3, 0.35
mm
Format
Sheet, die-cut pads
-