GT10D Thermal Pad

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Description

GT10D Thermal Pad is a thin but robust thermal interface material designed to provide effective heat transfer when space is limited, as well as reliable electrical isolation between components, such as TO-220 semiconductor packages. The fiberglass reinforcement carrier ensures pad integrity when handling and when large forces are applied during assembly and also provides excellent electrical isolation of greater than 6kV.

GT10D Thermal Pad is available with additional adhesive for assembly purposes and can be supplied on a roll or as die-cut parts to the customer’s specification.

  • 25mm thickness
  • Fiberglass Reinforced
  • High di-electric breakdown voltage
  • Operating temperature up to 180°C
  • Low tack
  • 5W/mK thermal conductivity
  • Low thermal impedance