GT30 Thermal Pad

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Description

GT30 Thermal Pad is Not Recommended for New Design (NRND) as it is planned to End of Life this material in due course.

We recommend GT10D, TG-ALC, TG-A38KF or TG-A20KF as suitable alternatives, subject to final approval by the customer.  Please contact us for more information.

Our GT30 Thermal Pad is produced by adding thermally conductive ceramic particles to a silicone matrix to give the material thermally conductive properties. Other additives, such as fire retardants, can be used to reduce flammability. The GT30 Thermal Pad is effective in lowering the thermal resistance between the heat source and the heat sink.

Features
Smooth surface & low contact resistance
Usable over a wide temperature range
Electrical insulation; high breakdown voltage

Applications
Electronic components: IC, CPU, MOS, LED, Motherboard, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecoms, Wireless Hub, DDR ll Module, DVD Applications, Hand-set Applications

Properties
REACH Compliant
ROHS Compliant

Property
Value
Unit
Type of Product
Thermal Interface Material
-
Thermal Conductivity
3.2
Wm/K
Dielectric Breakdown Voltage
(AC) 3.1 (DC) 5.1
kW/mm
Colour
Pink
-
Thickness
0.35
mm
Format
Sheet, die-cut pads
-
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