L37-3F / TG-A373F Thermal Conductive Pad

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Description

L37-3F is an ultra thin silicone based thermal interface pad which offers a good combination of high dielectric breakdown voltage, compliance and low thermal impedance. It contains a fibreglass mesh for enhanced ease of manufacture and is available in various formats such as standard sheets, log-rolls and custom die cut parts. L37-3F is available in a range of thicknesses.

Features
Made of silicone, thermal conductive particles, fibreglass
Low elongation
Electrical insulation
Easy to assemble

Applications
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.

L37-3F-150-150-0.25-0
L37-3F-150-150-0.25-1A
L37-3F-320-320-0.25-0
L37-3F-320-320-0.25-1A
L37-3F-150-150-0.3-0
L37-3F-150-150-0.3-1A
L37-3F-320-320-0.3-0
L37-3F-320-320-0.3-1A
L37-3F-150-150-0.45-0
L37-3F-150-150-0.45-1A
L37-3F-320-320-0.45-0
L37-3F-320-320-0.45-1A
L37-3F-640-320-0.45-1A
Property
Value
Unit
Type of Product
Thermal Interface Material
-
Thermal Conductivity
1.4
W/mK
Hardness
90
-
Dielectric Breakdown Voltage
4
kV/mm
Colour
Yellow
-
Thickness
0.25/0.3/0.45
mm
Format
Die-cut Pad, Pad, Sheet, Roll
-