PCM20P Phase Change Material

Description

PCM20P Phase Change Material is Not Recommended for New Design (NRND) 

We recommend TG-V833 as a suitable alternative, subject to final approval by the customer.  Please contact us for more information.

PCM20P phase change material is designed to fill air gaps and voids between heat sources and heat sinks, while at the same time displacing entrapped air between surfaces. PCM20P is a solid at room temperature for ease of manufacture and changes phase at the working temperature to give a low thermal impedance. PCM20P is available in a wide range of formats, such as standard sheets and custom die cuts depending on the end application.

Features
Naturally tacky and easy to use
Low thermal resistance
Long term reliability
Good thermal conductivity
Customised parts
Maximise the contact area between surfaces

Applications
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.