TG-AS606C / S606C Thermal Paste

Description

TG-AS606C / S606C Thermal Paste is a silicone based thermal paste that has been designed for high performance CPUs and similar applications. It has a thermal conductivity of 5 W/mK, superior wetting characteristics, resulting in a very low thermal resistance and excellent long-term reliability.

Features
Good thermal conductivity
Easy to assemble
High stability
Does not harden with time

Applications
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.