TG-A09AB Potting Compound

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Description

TG-A09AB Potting Compound is a thermally conductive silcone potting compound used to protect electronics from moisture and other undesirable environmental factors. TG-A09AB has thermal conductivity of 2.8W/mK and cures at room temperature in just 18 hours. Using heat to assist the curing process reduces the curing time down to just 30 minutes.