TG-A09AB Potting Compound

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Description

Description

TG-A09AB Potting Compound is a thermally conductive silcone potting compound used to protect electronics from moisture and other undesirable environmental factors. TG-A09AB has thermal conductivity of 2.8W/mK and cures at room temperature in just 18 hours. Using heat to assist the curing process reduces the curing time down to just 30 minutes.

Property

Value

Unit

Type of Product

Potting Compound

Thermal Conductivity

2.8

W/mK