TG-A20KF High Performance Thermal Pad

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Description

TG-A20KF is a soft, silicone based thermal interface material with a fibreglass re-enforcement carrier for ease of handling. TG-A20KF has a low thermal impedance, conforms readily to surfaces due to its low hardness and provides a very high dielectric breakdown voltage due to the fibreglass layer. TG-A20KF can be provided in a wide range of thicknesses and formats, such as custom die cuts or standard sheets depending on the end application.

Features:

Easy to handle and resistant to deformation
Low thermal impedance
Suitable for lower power applications
One sided natural tack

Property
Value
Unit
Type of Product
Thermal Interface Material
-
Thermal Conductivity
1.8
W/mK
Hardness
55
Shore 00
Dielectric Breakdown Voltage
>8
kV/mm
Colour
Dark Grey
-
Thickness
0.5-10.0
mm
Format
Pad, Sheets, Die-cut pad
-