TG-A6200LC Thermal Pad

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Description

TG-A6200LC Thermal Pad is a composite silicone thermal pad made from two different silicone materials. The main part of the pad is TG-A6200, an ultra-soft, low thermal impedance silicone material. The carrier of this pad is TG-ALC (also available separately) which provides increased strength and a low tack surface. The combined assembly of these two materials produces a thermal pad with excellent heat transfer characteristics with the additional benefits of improved handling and a non-tacky face to aid assembly and rework.

TG-A6200LC Thermal Pad is available with additional adhesive for assembly purposes and can be supplied as sheets or as die-cut parts to the customer’s specification.

  • Available in 0.5mm to 2.5mm thicknesses
  • Low tack on one side and easy to handle
  • High di-electric breakdown voltage
  • Operating temperature up to 180°C
  • 5.0 W/mK thermal conductivity
  • Low thermal impedance