TG-A96AB / A96AB Potting Compound
Description
TG-A96AB / A96AB Potting Compound is a thermally conductive epoxy based potting compound used to protect electronics from moisture and other undesirable environmental factors. TG-A96AB / A96AB has thermal conductivity of 2.6W/mK and cures at room temperature in just 12 hours. Using heat to assist the curing process reduces the curing time down to just 30 minutes. TG-A96AB / A96AB has a hardness of Shore A 68 which offers robust support for components.
Property
Value
Unit
Type of Product
Potting Compound
-
Thermal Conductivity
2.6
W/mK
Dielectric Breakdown Voltage
>11
KV/mm
Curing Time @ 25°C
12
Hrs
Curing Time @ 80°C
0.5
Hrs
Hardness
68
Shore A