TG-AD30D Low Outgassing Thermal Pad

Description

TG-AD30D Low-Outgassing Thermal Pad is the latest addition to our advanced TG-AD hybrid thermal pad series, TG-AD30D delivers the same soft, conformable thermal performance as the existing TG-AD30 while offering enhanced weight loss and outgassing characteristics for sensitive applications. TG-AD30D is ideal for high-performance and reliability-critical electronics that require ASTM E595 compliance for thermal management .

Designed for use in aerospace, AI systems, datacom, automotive electronics, military equipment, optical devices, and other sealed or contamination-sensitive environments, TG-AD30D combines efficient heat transfer with excellent material stability.

Key Features
Low-outgassing formulation verified to ASTM E595
Thermal conductivity: 3.0 W/mK
Low thermal impedance
Excellent electrical insulation
UL 94 V-0 flame rating
Soft and conformable material
Wide operating temperature range: -50°C to +150°C
REACH and RoHS compliant
Available in custom die-cut formats