TG-AD66 Ultra Soft Thermal Pad

Description

TG-AD66 Ultra Soft Thermal Pad is one of our latest high-performance silicone gap pads with a thermal conductivity of 6.5 W/mk. TG-AD66 is highly conformable with a Shore 00 Hardness of 25. TG-AD66 Ultra Soft Thermal Pad is formulated to achieve exceptional void filling between components and heat sinks with only a light amount of pressure and provides low thermal impedance for the most demanding of applications, including high speed networks and servers. TG-AD66 can be supplied in either standard sheets or custom die-cut parts in thicknesses ranging from 1.0 – 10.0 mm.