TG-ALC Ultra Thin Thermal Pad
Description
TG-ALC Ultra Thin Thermal Pad is a slimline silicone thermal pad designed to provide effective heat transfer when space is limited and when low thermal impedance is paramount. Available in 0.2mm or 0.3mm thicknesses, TG-ALC has low tack to aid assembly and handling. With a thermal conductivity of 4.2W/mK combined with the low thickness of the pad, TG-ALC achieves very low thermal impedances for demanding applications.
TG-ALC Ultra Thin Thermal Pad is available with additional adhesive for assembly purposes and can be supplied as sheets or as die-cut parts to the customer’s specification.
- Available in 0.2mm or 0.3mm thicknesses
- Low tack and easy to handle
- High di-electric breakdown voltage
- Operating temperature up to 180°C
- 4.2W/mK thermal conductivity
- Low thermal impedance