TG-ASD35AB Thermal Gel

Description

TG-ASD35AB Thermal Gel is a two-part, silicone based, flexible thermal gel.  This fast curing thermal gel offers 3.5 W/mK thermal conductivity and cures at room temperature within 2-4 hours depending on application thickness and will cure in just 15 – 20 mins when heated at 80℃.

TG-ASD35AB Thermal Gel is highly tolerant of thermal expansion and contraction and also remains stable under high vibration environments. This thermal gel is particularly well suited to ECUs and BMS applications to ensure stable performance of electronic components under extreme conditions and harsh environments.

TG-ASD35AB is available in either pots or pails for ease of application.