TG-ASD50AB Thermal Gel

Description

TG-ASD50AB Thermal Gel is a two-part, silicone based, flexible thermal gel.  This fast curing thermal gel offers an impressive 5.0 W/mK thermal conductivity and cures at room temperature within 2-4 hours depending on application thickness and will cure in just 20 – 40 mins when heated at 80℃.

TG-ASD50AB Thermal Gel is highly tolerant of thermal expansion and contraction and also remains stable under high vibration environments. This thermal gel is particularly well suited to ECUs and BMS applications to ensure stable performance of electronic components under extreme conditions and harsh environments.

TG-ASD50AB is available in either pots or pails for ease of application.