TG-N4000 Non-Silicone Thermal Putty

Description

TG-N4000 Non-Silicone Thermal Putty is a high performance thermal putty with a consistency between a liquid and a solid. With a high thermal conductivity of 4W/mK and the ability to effectively wet the thermal interface surfaces, it is suitable for the most demanding applications. TG-N4000 Non-Silicone Thermal Putty has a non-solid putty like consistency which makes it ideal for interfaces with poor surface finishes, high tolerances and multiple heat sources. TG-N4000 Non-Silicone Thermal Putty is available in syringes and pails for easy dispensing and high volume mass production applications.

Features

No outgassing of silicone compounds for silicone sensitive applications
High reliability
Lower contact thermal impedance than thermal pads
Easy to dispense

Applications

Automotive, Optronics, Medical Devices, Hard Drives, 5G, Aerospace, AI