TG-N8000 Non-Silicone Thermal Putty

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Description

TG-N8000 Non-Silicone Thermal Putty is a high performance liquid gap filler. With a high thermal conductivity of 8W/mK and the ability to effectively wet the thermal interface surfaces, it is suitable for the most demanding applications. TG-N8000 Non-Silicone Thermal Putty has a non-solid putty like consistency which makes it ideal for interfaces with poor surface finishes, high tolerances and multiple heat sources. TG-N8000 is available in syringes and pails for easy dispensing and high volume mass production applications.

Features

No outgassing of silicone compounds for silicone sensitive applications
High reliability
Lower contact thermal impedance than thermal pads
Easy to dispense

Applications

Automotive, Optronics, Medical Devices, Hard Drives, 5G, Aerospace, AI

Property
Value
Unit
Type of Product
Putty
-
Thermal Conductivity
8
W/mK
Operating Temperature
-40~+125
°C
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