TG-NSP80 Non-Silicone Thermal Putty

Description

TG-NSP80 Non-Silicone Thermal Putty is a one-part, fully cured non-silicone gap filler with has been designed to reduce the time to market and overall cost of ownership for production processes.

TG-NSP80 Non-Silicone Thermal Putty is provided fully cured, ready for dispensing which gives a significantly simpler design process and allows products to be brought to market with reduced lead-times. This product is also ideally suited for automation and T-Global Technology offers complete turn-key solution to support this.

TG-NSP80 Non-Silicone Thermal Putty provides:

• A low thermal impedance, when compared to traditional gap filler, for a wide range of gaps, which allows a greater degree of design flexibility to be achieved
• Proven reliability under conditions of thermal cycling, shock and vibration
• Deflects easily under low pressures which decreases stress on fragile or delicate components

Features
Easily dispensable from manual, semi-automatic or fully automatic systems
Full turn-key support from T-Global Technology
Low thermal impedance
High thermal conductivity
Ultra-low compression forces
High tack on most surfaces and reworkable
Proven long term reliability
Available in cartridges (30cc, 50cc, 75cc, 180cc, 360cc, 600cc,) and pails (2.1kg, 5kg, 9kg, 25kg, 36kg)

Applications
Consumer electronics
Set-top boxes
IP routers
ECUs
Memory and Power modules