TG-PCM095 Phase Change Material

Description

The TG-PCM095 phase change material is engineered to meet the thermal challenges of high heat-density electronics. At room temperature it remains solid for ease of handling, then automatically transitions phase under operating conditions to deliver significantly lower interface thermal resistance. With a thermal conductivity of 9.5 W/mK, TG-PCM095 offers ultra-efficient heat spreading, ideal for high-power, compact systems such as servers, AI hardware, 5G infrastructure, EV electronics, and advanced computing modules.

Features

Ultra-high thermal conductivity 9.5 W/mK:  among the highest in its class, effectively reducing interface thermal resistance.
Automatic phase transition at 45°c: absorbs and distributes heat, ensuring stable thermal performance under sustained loads.
Excellent long-term stability: designed for reliable thermal management in demanding applications.
Optimised for high heat-density devices: from communication equipment and power modules to automotive and computing electronics.

Applications

Suitable for use in: servers, laptops, networking and telecom equipment, semiconductor packaging modules, EV power electronics, high-density computing systems, 5G base stations, and other high-performance, high-heat devices.