TG-A09AB / TG-S09AB Potting Compound

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Description

Description

TG-A09AB / TG-S09AB Potting Compound is a thermally conductive silicone potting compound used to protect electronics from moisture and other undesirable environmental factors. TG-S09AB / TG-A09AB has thermal conductivity of 2.8W/mK and cures at room temperature in just 6 hours. Using heat to assist the curing process reduces the curing time down to just 30 minutes.

Property

Value

Unit

Type of Product

Potting Compound

Thermal Conductivity

2.8

W/mK