Description
TG-S606A-ULR is a non-silicone thermal grease with one of the lowest thermal resistances of all of our products and is ideal for thin bond line applications. TG-S606A-ULR is also extremely durable and will not pump-out making it ideal for applications requiring extended life and no degradation. TG-S606A-ULR is provided fully cured and ready for dispensing which gives a
significantly simpler design process and allows products to be brought to market with reduced lead-times. This product is also ideally suited for automation and T-Global Technology offers a complete turn-key solution to support this. This product provides:
• A low thermal impedance, when compared to traditional gap filler, for a wide range of gaps, which allows a greater degree of design flexibility to be achieved
• Proven reliability under conditions of thermal cycling, shock and vibration
• Deflects easily under low pressures which decreases stress on fragile or delicate components
Features
Easily dispensable from manual, semi-automatic or fully automatic systems
Full turn-key support from T-Global
Low thermal impedance
High thermal conductivity
Applications
Consumer electronics
Set-top boxes, IP routers, ECUs, Memory and Power modules