TG-S606P Thermal Compound

Description

TG-S606P is an ultra high performance silicone grease. It has a thermal conductivity of 8 W/mK, superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability.

Features
Good thermal conductivity
Easy to assemble
High stability
Does not harden with time

Applications
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.