TG-AS808 / TG-S808 Thermal Compound

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Description

TG-AS808 / TG-S808 Thermal Compound is a high-performance silicone based thermal compound that has been designed for high performance CPUs and similar applications. It has a thermal conductivity of 8 W/mK. TG-AS808 / TG-S808 Thermal Compound provides superior wetting characteristics, resulting in a very low thermal resistance and excellent long-term reliability.

Features

High thermal conductivity
Good levelling agent
Low pump-out
Low thermal impedance/thermal resistance
High stability

Applications

Electronic components: IC, CPU, MOS, LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.

S606P
S606
PP10
TGPP10
TG PP10
TG PP 10
606
TGS606
TG-S606P
TG-PP-10
S606C
TG837
837
TG 837
TG937
937
TG 937
Property
Value
Unit
Type of Product
Grease
-
Thermal Conductivity
8.0
W/mK
Colour
Grey
-
Format
Pot
-
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