TG-AS808 / TG-S808 Thermal Paste

Description

TG-AS808 / TG-S808 Thermal Paste is a high-performance silicone based thermal compound that has been designed for high performance CPUs and similar applications. It has a thermal conductivity of 8 W/mK. TG-AS808 / TG-S808 Thermal Paste provides superior wetting characteristics, resulting in a very low thermal resistance and excellent long-term reliability.

Features

High thermal conductivity
Good levelling agent
Low pump-out
Low thermal impedance/thermal resistance
High stability

Applications

Electronic components: IC, CPU, MOS, LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.