TG-V833 & TG-V838 Thermal Phase Change Materials

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Description

TG-V833 & TG-V838 phase change thermal interface materials are designed to fill air gaps and voids between between heat sources and heatsinks, while at the same time displacing entrapped air between surfaces. TG-V833 & TG-V838 are solid at room temperature for ease of manufacture and changes phase at the working temperature to give a low thermal impedance. TGV833 & TG-V838 are available in a wide range of formats, such as standard sheets and custom die cuts depending upon the end application.

Features
Naturally tacky and easy to use
Low thermal resistance
Long term reliability
Good thermal conductivity
Customized parts
Maximize the contact area between surfaces

Applications
Electronic components: IC, CPU, MOS, LED, M/B, P/S, Heat Sink, LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc. DDR II Module, DVD Applications, Hand-set applications, etc.

Property
Value
Unit
Type of Product
Phase Change Material
-
Thermal Conductivity
3.3, 3.8
W/mK
Colour
Grey
-
Thickness
0.13, 0.2, 0.3
mm
Format
Die-cut Pad, Sheet
-