TG-V838 phase change materials are designed to fill air gaps and voids between heat sources and heatsinks, while at the same time displacing entrapped air between surfaces. TG-V838 is solid at room temperature for ease of manufacture and changes phase at the working temperature to give a low thermal impedance. TG-V838 phase change materials are available in a wide range of formats, such as standard sheets and custom die cuts depending upon the end application.
Naturally tacky and easy to use
Low thermal resistance
Long term reliability
Good thermal conductivity
Maximize the contact area between surfaces
Electronic components: IC, CPU, MOS, LED, M/B, P/S, Heat Sink, LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc. DDR II Module, DVD Applications, Hand-set applications, etc.