TG6060-D Thermal Putty

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Description

TG6060-D Thermal Putty is a high performance silicone putty. With a thermal conductivity of 6.3W/mK and the ability to effectively wet the thermal interface surfaces, it is suitable for the most demanding applications. TG6060-D Thermal Putty has a non-solid putty like consistency which allows to be useful for interfaces with poor surface finishes, high tolerances and multiple heat source sights. TG6060-D is available in syringes for easy dispensing.

Property
Value
Unit
Type of Product
Putty
-
Thermal Conductivity
6.3
W/mK
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