THINC Thermal Insulation Cap

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Description

T-Global’s THINC Series thermal insulation caps are thermally conductive silicone caps for TO220 packages. They are electrically isolating, lightweight, easy to assemble and provide a low
thermal impedance whilst buffering the delicate components.

Features
Low thermal contact resistance
Electrically isolating
Easy to assemble
Thermal conduction and buffer effect

Applications
Electronic components: IC, CPU, MOS, LED, Motherboard, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecoms, Wireless Hub, DDR ll Module, DVD Applications, Hand-set Applications

Property
Value
Unit
Type of Product
End Caps
-
Thermal Conductivity
2
W/mK
Colour
Grey
-
Thickness
0.3 / 0.45
mm
Format
Piece
-