T-Global’s THINC Series thermal insulation caps are thermally conductive silicone caps for TO220 packages. They are electrically isolating, lightweight, easy to assemble and provide a low
thermal impedance whilst buffering the delicate components.
Low thermal contact resistance
Easy to assemble
Thermal conduction and buffer effect
Electronic components: IC, CPU, MOS, LED, Motherboard, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecoms, Wireless Hub, DDR ll Module, DVD Applications, Hand-set Applications