Choosing the best Thermal Pad

How to select the best Thermal Pad for your application?

Selecting the best thermal pad for your application is crucial for ensuring optimal thermal management in electronic devices. T-Global Technology are experts in thermal management with over 20 year’s experience in manufacturing and developing thermal interface materials for a range of industries worldwide.

Our flagship product range is thermal pads; all our pads are designed, developed, tested and manufactured at our state of the art production facility at our company headquarters in Taiwan.

We have a huge range of pads to choose from, each one designed with different properties for different applications.

This guide will help you to select the right thermal pad for your needs by outlining the various factors and properties that will help shape your decision.

Use the toggles below to find out more about the different factors to consider when choosing the best thermal pad for your requirements:

One of the primary considerations when selecting a thermal pad is whether to choose silicone or non-silicone material.

Non-Silicone Thermal Pads: Ideal for applications where silicone contamination is a concern, such as in optical or medical devices. Our non-silicone pads, are made from polyolefins instead of silicone and offer stable thermal performance without the risk of oil bleed or outgassing. Non-silicone pads tend to be harder than silicone alternatives and are not suitable for very high temperature environments.

Silicone Thermal Pads are the most common type of thermal pads and are known for their excellent thermal conductivity and flexibility. They are suitable for a wide range of temperatures and provide good insulation. However, they are prone to oil bleed and outgassing, which may not be desirable in certain applications.

Low Bleed Thermal Pads are the latest addition to our extensive product range of thermal pads and offer the performance of traditional silicone based pads with the added benefits of minimal oil bleed and outgassing which can significantly extend the performance and lifespan of components.

Low Outgassing Thermal Pads are engineered for applications where thermal performance must be combined with exceptional material cleanliness and long-term reliability. Manufactured to meet the stringent requirements of ASTM E595, these advanced thermal interface materials (TIMs) minimise the release of volatile compounds in enclosed, vacuum, and contamination-sensitive environments while delivering efficient heat transfer between components and heat sinks.

Oil bleed, the migration of silicone oil from the pad, can be a significant issue in certain applications. It can cause contamination and impact the performance of sensitive components. For applications where oil bleed is unacceptable, non-silicone thermal pads are recommended.

Thermal conductivity is a critical factor that determines how effectively the pad can transfer heat away from the components. Measured in Watts per meter-Kelvin (W/mK), higher values indicate better heat transfer capabilities. Our pads conductivities range from 1.2 W/mK up to 25 W/mK. As a general rule higher-power applications will require a pad with high thermal conductivity to ensure efficient heat dissipation.

Thicker pads can fill larger gaps and conform better to uneven surfaces to fill voids but may have lower thermal performance. Thinner pads offer better heat transfer but might not fill gaps as effectively. Using a thicker pad is recommended when mechanical tolerances are high. T-Global Technology offers thermal pads in various thicknesses with standard sizes of 0.5 – 8.0mm, allowing you to choose the optimal thickness for your application.

Compressibility refers to the pads ability to compress under pressure. It is desirable in most applications for the pad to be as soft and as compressible as possible. This ensures good contact with mating surfaces and maximises heat transfer. The softness of the pad is characterised by it’s level on the Shore hardness scales, the lower the value, the softer or more compressible the pad. As thermal conductivity increases the hardness of thermal pads tends to increase in parallel as more ceramic particles are included in the mix. Therefore selecting a thermal pad that has the right balance of compressibility and conductivity is a key consideration. Softer pads are more prone to oil bleed (silicone only) and can be trickier to handle during assembly.

Understanding the specific requirements of your application is crucial in choosing the right thermal pad and environmental factors will need to be considered.

Operating Temperature Range: Ensure that the thermal pad can withstand the operating temperatures of your device. Our standard silicone based thermal pads cater to a wide range of operating temperatures from -50°C to 200° C whereas non silicone pads are suitable for use in applications with an operating temperature of up to 125° C.

Electrical Insulation: If electrical insulation is necessary to protect components from electrical voltages, select a thermal pad with high dielectric strength (Dielectric Breakdown Voltage or DBV) to prevent electrical shorts which will lead to device failure. Typically our pads have DBVs of 6 kV/mm or greater, harder pads and those reinforced with fibreglass will have a higher DBV than our softer pads or those without fibreglass reinforcement.

Exposure to moisture, dust, or chemicals can all affect the performance of thermal pads, if you are using a pad which may be subject to these conditions it is best to opt for a harder reinforced pad  that can withstand these conditions. TG-A38KF is a fibreglass reinforced pad with a hardness of 60 (Shore 00) a DBV of >10 kV/mm and a thermal conductivity of 3.3 W/mK.

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Why choose T-Global Technology?

Choosing the right thermal pad involves careful consideration of various factors including those listed above. By evaluating these elements, you can select the most suitable option to ensure optimal thermal management and performance of your electronic devices. Our expert team are able to assist you in choosing the ideal solution for your individual requirements. We can work with you at any stage of your product design to solve your thermal management challenges, either by recommending an existing product from our range or by working with you to develop a custom formulation tailored to your specifications.

Explore and compare our extensive range of thermal pads to find the perfect solution for your specific needs or contact us to discuss your requirements in more detail by clicking on of the buttons below.

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